Schönox AP Rapid Plus

Self-leveling Compound based on Hybrid Active Dry Technology designed for deep pour, fast track installations on most substrates in interior areas such as apartment buildings. Schönox AP Rapid Plus can be installed above 1/8″ up to 3″, in small, well defined areas without limitation.

Please refer to the Technical Datasheet for more information.

Learn more about Hybrid Active Dry Technology

Technical Data

  • Compressive Strength
    • Approx. 40 N/mm² / 6300 psi at 28 days
  • Coverage
    • Approx. 14 sq.ft. at 1/2“
    • (depending on substrate conditions and aggregate used)
  • Emicode
    • EC 1 PLUS: very low emission
  • LEED
    • EQc2 – 3 points Low-Emitting Materials
    • MRc1 – up to 2 points Life-Cycle Impact Reduction
    • MRc2 – 1 point Environmental Product Declaration
    • MRc3 – 1 point Sourcing of Raw Materials
    • MRc4 – 1 point Material Ingredients
  • Pot Life
    • Approx. 30 minutes at 68˚F
  • Ready for covering
    • after 16 hours at 1/2“ thickness
    • After 48 hours at 2“ thickness
  • Shelf Life
    • 1 year unopened
  • Working Temperature
    • 41°F – 90°F
  • Packaging
    • 25kg / 55lb. net weight in paper bags
  • Storage
    • Store in cool and dry conditions

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