Schönox FP

Schönox FP is a flexible, one-part filling and priming compound for priming and filling in one step. Prevents self-leveling underlayments from passing through joints and breakouts in wooden floors or similar substrates to be renovated. May be used to embed SCHÖNOX RENOTEX® for substrate solidification.

Emicode - low-emissions product. HPS Schönox Subfloor Solutions

Technical Data

Coverage

Approx. 200-400 sq.ft. depending on porosity of substrate and layer thickness applied
Approx. 130 sq. ft. if used to embed SCHÖNOX RENOTEX® for substrate solidification

Emicode

EMICODE EC 1: very low emission

LEED

EQc2 Low-Emitting Materials, 3 points
MRc2 Environmental Product Declaration, up to 2 points
MRc3 Sourcing of Raw Materials, 1 point

Working Temperature

Not below 41°F

Pot Life

Approx. 30 minutes

Ready for Covering

Ready for SCHÖNOX leveling compounds; depends on layer thickness approx. 60-180 minutes

Shelf Life

1 year unopened

Packsize

33 lb. net weight in paper bags

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