Press Releases

HPS Schönox launches new wood flooring adhesive with Silane technology

MSP Classic Product Debuts at NWFA Wood Flooring Expo

Dallas, TX – April 2, 2013

HPS Schönox is bringing a new technology to the flooring industry launching its new MSP Classic, universal wood flooring adhesive at this week’s NWFA Wood Flooring Expo. The new product uses silane modified polymers, the most advanced technology in adhesives. “We are continuing to introduce strong solutions for flooring projects taking a fresh look at ways to improve installations,” remarked Enos Farnsworth, president of HPS Schönox. “MSP Classic improves on every facet of the wood flooring adhesive process.”

Schönox was the first manufacturer to develop an adhesive based on the silane technology in 1995 and has been improving and enhancing the product ever since. Silane modified polymers create a tenacious bond to all types of wood flooring and a wide variety of substrates. With an extremely hard yet flexible ridge, this product develops high bond strength yet dissipates shear forces and reduces their damage to the substrate. “Put more simply, MSP Classic has elastic qualities that allow movement of the wood flooring which is especially helpful with fluctuations of temperature and humidity while at the same time maintaining a very strong bond to really different substrates,” explained Karen Bellinger, HPS Schönox Business Development. “Like so many of our new products, installers only have to use it once to make a change to it moving forward.”

Silane technology improves the ability to bond flooring product to diverse substrates, cure without the formation of bubbles, and greatly improves the elastic recovery of the adhesive. MSP Classic does not require priming before use, can be applied to non porous substrates, has no waiting time before installation can begin, and bonds well with exceptional strength but retains elastic qualities. “I’m in the field every day working with installers who are starting to use MSP Classic,” commented Russell Wright, HPS Schönox Territory Business Manager. “This is a product that will save installers time and money while delivering a better overall wood flooring installation.”

MSP Classic joins a comprehensive line of primers, repair mortars, floor leveling compounds, and adhesives provided by HPS Schönox. “The true strength of our products is leveraged when they are used in tandem,” explained Wright. “A strong, smooth subfloor provided by the use of our self leveling compounds paired with an advanced adhesive like MSP Classic yields a flooring installation second to none.”

MSP Classic contains no solvents or water eliminating any swelling effect on moisture sensitive wood flooring. “MSP Classic continues our commitment to environmental concerns as it contains no VOCs,” remarked Bellinger. “We are proving that you can have subfloor products that work better with smart technology paired with the highest level of environmental responsibility.”

This is the first year that HPS Schönox has been an exhibitor at the NWFA Wood Flooring Expo. The Expo runs from April 2 through 5 at the Gaylord Texan Resort in Dallas. With more than 3000 professionals attending, The Wood Flooring Expo is the only trade show in the world dedicated solely to wood flooring. “We have a unique opportunity for the flooring industry to use a series of products with greatly updated technology levels,” said Farnsworth. “These are proven technologies that are already used with great success in 20 counties; our job is to make them known in the US.”

About HPS Schönox

Schönox HPS North America, Inc., a business unit of TMT America, Inc., is a customer-oriented, entrepreneurial, high-tech company specializing in subfloor solutions for new construction, as well as renovation and occupied spaces. Innovative products include primers and moisture mitigation systems, subfloor repair products, floor-leveling compounds, adhesives, and waterproofing materials for installing floor coverings. For more information about Schönox products, contact the Marketing Department by emailing moc.s1718485760roolf1718485760busph1718485760@gnit1718485760ekram1718485760, calling toll free 855.391.2649, or visiting